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Self-assembly of a novel 3D copper(I)-tetrazolate supramolecular framework via interpenetration of porous 2D double-layer motifs

Release time:2021-11-19
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Affiliation of Author(s):
化学化工学院
Journal:
无机化学通讯
Co-author:
籍文娟,蒋育澄,李淑妮,高霞
Correspondence Author:
胡满成
Volume:
13
Issue:
1
Page Number:
211–214
ISSN No.:
1387-7003
Translation or Not:
no
Date of Publication:
2010-01-01